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[Web Seminar] Basics of Plating in the Lithography Process

Plating in the lithography process, basics of resist masks and troubleshooting measures - Stabilization of shape and dimensions, adhesion and peeling, bubble and defect countermeasures.

In recent years, plating technology has established its importance as a foundational technology in the electronics industry. In electronics such as semiconductor devices, high-frequency printed circuit boards, and MEMS, it is primarily utilized as a wiring formation technology. Additionally, lithography technology is necessary to form high-precision wiring and plug structures. This technology forms a plating layer limited to areas designed with a resist mask. The resist mask is also used as an etching mask. High precision of the resist mask is essential for controlling the wiring shape through plating. In this seminar, we will discuss the plating technology of wiring materials such as Cu and Ni, the basics of lithography technology, and the enhancement of resist mask precision. We will also explain troubleshooting methods for issues such as mask deformation and mask peeling. This course is designed to be easy to understand for beginners, allowing them to learn from the basics. Additionally, we will address daily troubleshooting consultations that participants may have.